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The 300FA Automated Failure Analysis system integrates more applications with ergonomic ease of operation. A small footprint, high speed, low cost per feature and serviceability contribute to its award winning CoO. |
FEATURES :
- Small footprint
- Mounted on casters and extendable leveling posts for mobility
- Configurable for Fab or FA lab
- User customizable enclosure & layout
- Field serviceable robot & peripherals
Custom System Configurations :
- One Bridge Tool for both 200 & 300mm Wafers; auto wafer size recognition, no calibration
- 1 or 2 Cassette Platforms for manual loading in FA lab
- FOUP indexers available
- OCR and 2D Matrix recognition
- Photonic Laser Marker compatible
- Zeiss Optics - BF, DF, DIC, VIS & UV Confocal modes with 80 - 100nm visibility (shown)
- Can integrate all major microscope brands including your existing scopes
- Hi – Precision Stage with embedded 12” x 12” Reticle for maximum accuracy
- 20” Hi Res Flat Panel Display
- Active Mini Environment or Passive Enclosure (shown) or open table top design
The system's SITEview software includes :
- FA Navigation Software
- User customizable screen
- Automated “manual load” mode for single wafer or wafer piece loading with Deskew
- Defect Review – visit defect sites using defect review file data (any file format)
- Sorting
- Second Optical Inspection
- Image Storage & Retrieval
- GEM/SECS II
- Host Communication – LAN
- UV Microscope Interface
Facilities :
- 120V/20A Single Phase, One power cord
- Vacuum – 25”/600mm Hg
Product Footprint (units in inches)
