The demands of 300mm wafer technology requires a stage that has both extended travel range in addition to the highest positioning performance. The LEP 12”x12” stage is designed to meet or exceed those requirements.

• 305mm X 305mm (12" X 12") travel range
• 4mm recirculating ball leadscrew
• High resolution rotary encoder with 0.4µm resolution
• Hardened, ground crossed roller bearing guide ways
• Solid aluminum insert plate standard
• Highly stable design for long-term repeatable performance
• Optional X-Y grid scale for the highest accuracy

The stable design employs oversized stainless steel crossed roller bearing guideways.  Heavy components assure the long-term stability.  Without compro­mise, this stage minimizes its three-dimensional envelope with clever design and strict manufacturing processes.

The stage is available with either stepper motors or DC servo motors. Cou­pled with precision recirculating ball leadscrews, performance is maintained at all speeds. Maintenance is minimal.  Standard on all stages are high resolution rotary encoders which provide position feedback.

The optional X-Y grid encoder adds increased performance for the most de­manding applications.  With 0.4 micron repeatability and very high accuracies this stage is suited for applications such as defect review and bit mapping.

• High accuracy 12x12 stepper motor stage with X-Y grid encoder
• High accuracy 12x12 stepper motor stage with rotary encoder
• High accuracy 12x12 DC servo motor stage with X-Y grid encoder
• High accuracy 12x12 DC servo motor stage with rotary encoder

TechnicalSpecifications (Weight = 18.6 kg., Height = 53mm at object plane):

Specifications	Stepper Motor	DC Servo Motor	Grid Encode
Max. Speed	120mm/sec.	250mm/sec.
Resolution	0.1 µm	0.4 µm	0.2 µm
Repeatibility	2.0 µm	2.0 µm	0.4 µm
Accuracy	12µm/300mm	12µm/300mm	3µm/300mm
Straightness	1µm/25mm	1µm/25mm	1.5µm/300mm
Flatness	1µm/25mm	1µm/25mm	1.5µm/300mm