The LEP robot has many design features that make it unique. First, the platform mount vastly improves the ease of assembly and service. The telescoping lift axis provides long range of motion while requiring very little space. The linear radius axis and precision rotation axis ensure the highest wafer placement accuracy.

 

High Reliabilty

The LEP 300mm robot is designed for high reliability.  There are no complicated mechanisms, drive trains or multi-link arms that are prone to failure and misalignment.

 

Serviceable

While the 300mm robot is designed to be very reliable, it is also designed for easy service and maintenance.  Owing to the unique design, maintenance can be performed with the robot installed in place, no time consuming removal is necessary. For the same reasons, most repairs can be performed in place as well.

 

Expandable

Optional accessories can expand the handling system to a complete automation system. With the MAC 2002 controller as a foundation, accessories such as a cassette mapper, notch aligner and X-Y positioning stage can be added to build a complete automation package.  Custom accessories can be added as well.

 

 

Options and Specifications

 

Robots

• 300mm Robot without cassette mapper
• 300mm Robot with cassette mapper

Options

• Notch finder for 200/300 mm wafers
• 300mm precision XY stage
• Vacuum end-effector
• MAC 2002 Controller (Controller system for robot available, as well as controller system for XY stage and robot combined.  Additional expansion components available)

Physical Dimensions

• Reach (center of robot to center of wafer) ...... 457 mm [18”]
• Minimum Height (to lower pickup arm) ........ 352 mm [13.875”]
• Maximum Height(to lower pickup arm) ..... 578 mm [22.76”]
• Minimum radius ...................................... 517 mm [13.13”]
• Weight.................................................. 21.8 kg [48lbs]

Motion Axes: Range

• Radius axis.................. 431 mm [17”]
• Theta axis.................... 355 degrees
• Lift axis ........................ 226 mm [8.9”]

Motion Axes: Resolution

• Radius axis.................. 2.9 µm
• Theta axis.................... 1.08 arc sec
• Lift axis ........................ 0.04 µm

Motion Axes: Speed (max)

• Radius axis.................. 515 mm/sec
• Lift axis ........................ 75 deg/sec
• Theta axis.................... 100 mm/sec

Facilities

• Power (with MAC 2002 controller): 100-240VAC 50-60Hz 250watts
• Vacuum ........................24 in. Hg