Shrinking geometries and tighter process controls demand the highest precision for positioning. This stage offers accuracy never before possible in a low profile stage. Even though this is a low profile stage, it is still a very substantial construction.
FEATURES :

203mm X 203mm (8" X 8") travel range
4mm recirculating ball leadscrew
High resolution rotary encoder with 0.4µm resolution
Hardened, ground crossed roller bearing guide ways
8µm accuracy over full range of travel
Optional X-Y grid scale for the highest accuracy

This stage is available with either high performance DC servo motors or ultra-reliable stepper motors to suit you application and preference. The optional two dimensional grid encoder offers high resolution, high accuracy performance. By mounting the grid directly under the wafer chuck the encoder reads actual wafer position independent of hysteresis and backlash. This is the most accurate low profile stage available.

Of course, the standard LEP features are included; strain-free cabling, anti-creep bearing cages and universal mounting. Adjustable end-limits are available but not standard.

Versions available :

High accuracy 8x8 stepper motor stage with X-Y grid encoder
High accuracy 8x8 stepper motor stage with rotary encoder
High accuracy 8x8 DC servo motor stage with X-Y grid encoder
High accuracy 8x8 DC servo motor stage with rotary encoder

TechnicalSpecifications (Weight = 8.9 kg., Height = 53mm at object plane):

Specifications Stepper Motor DC Servo Motor Grid Encoder

Max. Speed 120mm/sec. 250mm/sec.

Resolution 0.1 µm 0.4 µm 0.1 µm

Repeatibility 2.0 µm 2.0 µm 0.2 µm

Accuracy 10µm/200mm 10µm/200mm 2µm/200mm

Straightness 1µm/25mm 1µm/25mm 1µm/200mm

Flatness 1µm/25mm 1µm/25mm 1µm/200mm